Successful Laser Debonding

Monday, Jan 18, 2021

Debonding of temporary mounted wafer stack turned out to be challenging within the project – Final solution found with Laser Debonding performed on EVG®850 DB Automated Debonding System!

Two different debonding techniques have been studied throughout the Asteroid project working with 150 mm and 200 mm wafer sizes.

  • Slide-off Debonding Technique
    • Challenge due to brittle stack and CTE issues triggered by debonding temperature causing breakage of the ROIC layer
  • Laser Debonding Technique
    • Optimum debond performance with this brittle stack and no issues with the ROIC layer; tested with 150 mm material and 200 mm material is on the way
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